bandar798| Quanda Technology (002516.SZ): CIIC and its holding subsidiary NSD have mature WLP wafer-level, chip-level and ceramic packaging technologies

Gelonghui, May 24 丨 Some investors asked Quanda Technology (002516) on the investor interactive platformbandar798.SZ) Questionsbandar798,"The packaging technology of die chips, wafer-level packaging, chip-level packaging, and ceramic packaging of CIIC's products is at the leading level in the same industry?", The company replied that CIIC and its holding subsidiary NSD have mature WLP wafer-level, chip-level and ceramic packaging technologies and are in a leading position in the industry.